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Both-side alignment and the ability for proximity and soft contact exposure are possible.
It is a mask aligner that aligns a glass mask and a workpiece in the photolithography process for wafers and glass substrates, transferring a fine mask pattern onto the photoresist coated on the plate.
The illumination distribution of the exposure light source is within ±5%! A lineup of desktop and standalone models is available.
The "BA100/160/200" is a manual double-sided mask aligner that achieves high positional accuracy patterning on both the top and bottom sides. In addition to the desktop models "BA100" for 4-inch wafers and "BA160" for 6-inch wafers, there is also a standalone model "BA200" for 8-inch wafers. Furthermore, the alignment accuracy is ±2μm on the top side and ±5μm on the bottom side. 【Specifications (excerpt)】 ■ Wafer size: 4in/6in/8in ■ Exposure light source intensity distribution: within ±5% ■ Exposure resolution ・Soft contact: L/S 3μm ・Hard contact: L/S 1μm *For more details, please refer to the PDF document or feel free to contact us.
